SP900EAAC-58

SP900EAAC-58



Производитель:

Bergquist
Описание:
 HEATPAD TO-220 W/ADH .009" SP900
Категория:
 Fans, Thermal Management
Корпус:
 --
Год:
 --

Datasheet (Техническое описание) SP900EAAC-58

Поиск в бесплатном архиве даташитов datasheet.su


Посмотреть все характеристики
Technical/Catalog InformationSP900EAAC-58
VendorBergquist
CategoryFans, Thermal Management
UsageTO-220
ShapeRectangular
MaterialSilicone/Fiberglass
Thermal Conductivity1.6 W/m-K
Thermal Resistivity0.6°C/W
Thickness0.009" (0.23mm)
Outline19.05mm x 12.70mm
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names SP900EAAC 58
SP900EAAC58
BER183 ND
BER183ND
BER183


 
Похожие микросхемы:


SP900S-90
HEATPAD TO-220 .009" SP900
SP900S-58
HEATPAD TO-220 .009" SP900
SP900S-54
HEATPAD TO-220 .009" SP900
SP900S-43
HEATPAD TO-220 CLIP .009" SP900
SP900S-25
HEATPAD DO-5 LARGE .009" SP900
SP900S-114
HEATPAD TO-220 .009" SP900
SP900S-105
HEATPAD SIP .009" SP900
SP900S-104
HEATPAD TO-247 .009" SP900
SP900S-05
HEATPAD TO-3/TO-66 .009" SP900
SP900S-02
HEATPAD TO-3/TO-66 .009" SP900
SP900S-0.009-00-12-NA
HEATPAD TO-18
SP900EAAC-54
HEATPAD TO-220 W/ADH .009" SP900
SP900EAAC-05
HEATPAD TO-3 W/ADH .009" SP900